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Grinding Wheel, Bond Disc (SC0821-SC0824)
 Grinding Wheel, Bond Disc (SC0821-SC0824) |
Product Description
SC0821. Metal Bond Cup grinding Wheel
SC0822. High Precision Kerf Wheel
SC0823. Silicon wafer
SC0824. LCD Edge Grinding Wheel
Our products are widely applied on cutting and grinding the materials of Ferrite magnetic core, Piezoelectric ceramic, Electronic glass, Optical glass, Automobile glass, Hard alloy, Precision ceramic, Silicon wafer, IC assembly and etc. They can classified into:
(1) Metal Bond
(2) Resin Bond
(3) Vitrified Bond
(4) Electroplated Bond
(5) Brazed Bond
(6) Hybrid Bond
| Company: | Danyang Huada Leather Goods Co., Ltd. |
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